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2018年 先后5为期

兼具导电及抗原子氧性能的复合薄膜制备及性能
曲春艳,李辽辽,刘长威,王德志
(葡京游戏平台官方网站 原油化学研究院,江苏 银川 150040)
摘 要:聚酰亚胺薄膜因她可以的耐热性和绝缘性在飞行航天应用广泛,但她容易在低地球轨道受到原子氧的侵权,使他各项优异性能退化至丧失。老大采用原位自金属化法对聚酰亚胺薄膜进行开环刻蚀、离子交换和热还原后,筹备出PI/Ag的复合薄膜,基于PI/Ag的复合薄膜结合刮涂的办法在外部引入抵抗原子氧侵蚀的含硅聚酰亚胺,于是制备出两种浓度的PI/Ag/Si-PI复合薄膜。并对伊进行XPS, SEM和抗原子氧辐照测试等特征,结果发现PI/Ag/Si-PI复合薄膜具有得天独厚的抗原子氧性能,且较高浓度的功力更佳。外面Si-PI在原子氧辐照过程中形成致密的SiO2来进一步抵原子氧的侵权,于是保护与伊紧挨着的基层及导电银层,于是保证了兼具导电及抗原子氧性能的复合薄膜。
关键词:复合薄膜;抗原子氧;聚酰亚胺;质损失
 
官方图分类号:O 631.31;TQ 317.6 文献标识码:A 文章编号:1001–0017 (2018)05–0318-04

The Preparation and Performance of Composite Films with both Conductivity and Anti-atomic Oxygen Properties.

QU Chun-yan, LI Liao-liao, LIU Chang-wei and WANG De-zhi

(Institute of Petrochemistry, Heilongjiang Academy of Sciences, Harbin 150040, China)

Abstract: The polyimide film is widely used in the aerospace because of its good heat resistance and insulation. But it is vulnerable to the atomic oxygen erosion in low earth orbit and it will make its various outstanding performances degrade to lose finally. At first, the method of in situ self-metallization is adopted for the process of ring opening etching, ion exchanging and thermal reduction of polyimide to prepare PI/Ag composite film. Then based on the PI/Ag composite film combined with blade coating, the polyimides containing silicon which possesses the atomic oxygen erosion resistance is introduced on the surface, thus the PI/Ag/Si-PI composite films with two kinds of concentrations are prepared. The products are characterized by XPS, SEM and anti-atomic oxygen radiation test and the results show that the PI/Ag/Si-PI composite films have better anti-atomic oxygen performance and the higher concentration, the better effect they have. The Si-PI on the surface layer will form the compact SiO2 in the process of atomic oxygen irradiation to further resist the atomic oxygen erosion, thus to protect the lower layer next to it and the conductive silver layer, so as to ensure both the conductivity and atomic oxygen resistance of the composite films.

Key words: Composite film; atomic oxygen resistance; polyimide; mass loss

 
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